Opening Ceremony Tuesday (Stage A)

09.05		Dr. Kazi Károly – President of NESH Briefing of the president of the National Electronics Society of Hungary
09.10	InnoElectro Grand Prize ceremony

Design Tuesday (Stage A)

10.00		Attila Kolinger – Microchip Technologies You can keep up with the accelerating technological evolution!
10.30		György Szegedi – Silicon Laboratories IoT 2025: Connected Intelligence – Opportunities, Challanges, and What's Behind It
11.00		Szabolcs Gigor – Phoenix Contact Ltd Efficiency in wiring

Artificial Intelligence in Design – Panel discussion Tuesday (Stage A)

11.30

István Nadj – István Nadj–Zsikla Miklós Will engineers be needed in the future? – AI-based technologies in PCB design

Efficiency, reliability, quality control in manufacturing Tuesday (Stage A)

13.00		Csaba Varga – Brady How can you revolutionize PCB traceability?
13.30		Miklós Kállai – Europe Unicomp Technologies Which is better? Sealed or Open X-Ray source: Performance, Maintenance and Application fields
14.00		Péter Gordon Phd – EFI-Labs Technical cleanliness – where are we heading in 2025?
14.30		Tamás Hurtony Phd – EFI-Labs The periodic table in our pocket - the building blocks of electronic products

Engineering Education – Panel discussion Tuesday (Stage A)

15.30

Dr. László Csaba Ábrahám – Charaf Hassan – Jakab Roland The Future of Engineering Education in Hungary

Innovation in manufacturing I. Tuesday (Stage B)

10.00		Thomas Ginzel – ATT HUNGÁRIA KFT – VERMES TECHNIK GMBH & CO KG The Art of Microdispensing
10.30		Cristian Tudor – Indium Corporation – E-Tronics Electrification & Power Modules – Innovative High Reliability Solder Materials
11.00		Sruti Balasubramanian – Actnano Inc. – Danutek Actnano coatings for protecting high reliability electronics
11.30		Béla Bődi – Elas Kft. Everybody does it differently, or a few words about thermocouple attachment methods!
12.00		Péter Szabó – Elas Kft. Cleaning before coating - the latest insights

Innovation in manufacturing II. Tuesday (Stage B)

13.30		András Pruszák – Panasonic Factory Solutions Europe – E-Chain Resilience and possibilities in the electronic manufacturing – Panasonic’s Autonomous Factory
14.00		Martin Kostadinov – Saki Europe s.r.o. – Tech Gear Solder Inspection Outside to Inside
14.30		Markus Haas – Herrmann Ultraschalltechnik – Microsolder Kft. The impact of advanced ultrasonic welding on battery integrity and efficiency scaling up battery production
15.00		Vitor Barros – IRaptor Lda / Quiptech Importance of Vibration and Temperature Monitoring
15.30		Sebastian Legierko – Viscom AG Latest Electronics Production – Fully Connected

Industry trends Wednesday (Stage A)

10.00		Tamas Rozsa – Top Tier Consultants (Strategic partner of EY-Parthenon) Quantifying Change: Navigating the 2025 Automotive Industry Bottom and the Road Ahead in Europe
11.30		Beáta Balázs Top Electronics and Innovation Marketplaces in Hong Kong

CyberSecurity Wednesday (Stage A)

11.30		Gergely Bakos – QIMA – CCLab Is Your Product Cyber Resilient?
12.00		Tibor Szarka – Microchip Technology Inc. The Impact of Cyber Resilience Act on Products Containing Digital Element

Innovation in manufacturing III. Wednesday (Stage A)

13.30		Andreas Heltmann Sustainable reflow technology: Optimization for the SMD production
14.00		András Kozma – Heller Industries – Amtest Group The application of vacuum technology in the reflow soldering process.
14.30		Rui Vidal LX-8 The Brand New, Flexible High Speed Placement Platform

Space and defense industry Thursday (Stage A)

11.00		Péter Németh – PCD Design Kft. PCIe based MMU development
11.30		Mátyás Hazadi – Puli Space Technologies Snooping water on the Moon

Closing Ceremony Thursday (Stage A)

14.35		Péter Regős – organizer of the NESH Student Soldering Competition MELT Student Soldering Competition announcement of results
14.45		Philippe Léonard – Senior director, European operations, IPC IPC Hand Soldering Competition announcement of results
14.55		Zsolt Heiling – InnoElectro Closing remarks